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SI643HU
SI643HU的图?/></a></div></div></div>         <div class=
参考报价:
面议
品牌9/dt>
关注度:
1894
样本9/dt>
暂无
型号9/dt>
高Tg,高模量,IC封装载板
产地9/dt>
江苏
信息完整度:
典型用户9/dt>
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Remarks:

All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature inℂ/span>and the third digit the relative humidity.

Items Condition Unit SI643HU SI643U
Tg DMA ℂ/td> 245 230
Td 5% wt. loss ℂbr/> 409 400
CTE (Z-axis) x/y-axis(α1) ppm/ℂ/td> ~10 12-13
(40-260?, z-axis(α1/α2)1)
ppm/ℂbr/> 25/143 27/150
Dielectric Constant (1GHz)
- - 4.5 4.4
Dissipation Factor (1GHz)
- - 0.007 0.007
Solder Dipping
288 ℂbr/> min
>30 >30
Peel Strength1)
1/3 Oz, VLP Copper Foil N/mm 0.73 0.8
Young’s modulus
50ℂbr/> GPa 25 22
200ℂ/td> GPa 22 15
Flexural modulus1)
50ℂ/td> GPa 28 26
200ℂ/td> GPa 18 16
Water Absorption1)
A % 0.17 0.2
85?85%Rh, 168Hr % 0.54 0.63
Flammability
UL-94
Rating
V-0
V-0
Thermal Conductivity
- W/(m·K) 0.61 0.58




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