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Remarks:
All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature inℂ/span>and the third digit the relative humidity.
Items | Condition | Unit | SI643HU | SI643U |
---|---|---|---|---|
Tg | DMA | ℂ/td> | 245 | 230 |
Td | 5% wt. loss | ℂbr/> | 409 | 400 |
CTE (Z-axis) | x/y-axis(α1) | ppm/ℂ/td> | ~10 | 12-13 |
(40-260?, z-axis(α1/α2)1) |
ppm/ℂbr/> | 25/143 | 27/150 | |
Dielectric Constant (1GHz) |
- | - | 4.5 | 4.4 |
Dissipation Factor (1GHz) |
- | - | 0.007 | 0.007 |
Solder Dipping |
288 ℂbr/> | min |
>30 | >30 |
Peel Strength1) |
1/3 Oz, VLP Copper Foil | N/mm | 0.73 | 0.8 |
Young’s modulus |
50ℂbr/> | GPa | 25 | 22 |
200ℂ/td> | GPa | 22 | 15 | |
Flexural modulus1) |
50ℂ/td> | GPa | 28 | 26 |
200ℂ/td> | GPa | 18 | 16 | |
Water Absorption1) |
A | % | 0.17 | 0.2 |
85?85%Rh, 168Hr | % | 0.54 | 0.63 | |
Flammability |
UL-94 |
Rating |
V-0 |
V-0 |
Thermal Conductivity |
- | W/(m·K) | 0.61 | 0.58 |
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