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无卤,高CTI,铝基覆铜板
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Remarks:

1. Typical value is based on specimen of 1.5mm Al/100μm dielectric/1oz Cu.

2.All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.


Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature inℂ/span>and the third digit the relative humidity.

Items Method Condition Unit Typical Value
Thermal Conductivity ASTM-D5470 A W/ (m•K) 1.1
Thermal Resistance ASTM-D5470 A K·cm2/W 0.91
Tg 2.4.25D DSC ℂ/td> 100
Td
2.4.24.6 Wt 5% loss ℂ/td> 410
Thermal Stress 2.4.13.1 288? solder float min
30
CTE (Z-axis) 2.4.24 Before Tg ppm/ℂ/td> 27
After Tg ppm/ℂ/td> 30
50-260ℂ/td> % 0.74
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ.cm 106
Surface Resistivity
2.5.17.1
C-96/35/90 107
Dielectric Breakdown 2.5.6 D-48/50+D-0.5/23 kV 6.0
Peel Strength (1oz) 2.4.8 288?10s N/mm 1.4
Flammability
UL94
C-48/23/50
Rating
V-0
MOT UL A ℂ/td> 130
CTI IEC60112 A Rating PLC0




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