AutoWafer Pro?: Ultrasonic Equipment for NDT of Bonded Wafers

A flexible� automated wafer inspection system designed for production� AutoWafer Pro provides fast� high-resolution scanning of 200mm and 300mm bonded wafers. It’s the ideal ultrasonic equipment for identifying bond defects in wafer applications such as MEMS� BSI Sensors� CMOS� memory� TSV and LED.

With extensive analysis capabilities at both the wafer and device level� there’s no need to reload and rescan wafers to get all the diagnostic images you need. And with high-speed scanning managed by fully automated wafer handling� AutoWafer Pro supports 100% nondestructive testing (NDT) for improved yields and a faster time to market.

• The ideal ultrasonic equipment for detecting wafer-to-wafer bonding defects

• A fully automated� production-ready wafer inspection system for MEMS� CMOS� BSI sensors� memory� TSV� LED and other applications employing wafers 200mm and smaller

• Provides wafer map with die-level pass/fail indicators (optional)

• Provides analysis (optional)

• 200mm SECS/GEM

• TSV entrenched metrology

• Fast� high-resolution scanning of 200mm and 300mm wafers for production environments

• Fully automated robotics using open cassettes� SMIF Pod� FOUPs or FOSB handling

• Class 1 clean room compliant� with integrated HEPA filter

• 300mm SECS/GEM (optional)

• KLARF compatible (optional)