To identify the smallest and most subtle defects in leading-edge packaged microelectronic applications� ECHO VS includes standard features such as heated water for optimum acoustic coupling� Flexible TAMI for efficient capture of the most useful data� Waveform Averaging for an improved signal-to-noise ratio� ICEBERG for improved image quality and MFCI for enhanced image quality in the most demanding applications. ECHO VS is the ultimate ultrasonic NDT equipment for molded flip chip� CSP� MCM� stacked die� MUF and other advanced packaging technologies.

• Detects air defects as thin as 0.01 micron and spatially resolves defects down to 5 microns.

• Image Enhancement Suite with heated water� waveform simulation and other innovations for industry-leading image quality in advanced packaging applications

• Image optimization for improved image quality in complex molded flip chips (MUF) and packages with polyimide layers

• Waveform averaging for improved signal-to-noise ratio

• Transducers from 15MHz through 300MHz� designed and matched in-house to address all types of applications and materials

• Stacked Die Imaging (SDI) (optional)

• Molded Flip Chip Imaging (MFCI)