RELAND 115系列基本组成9/span>湿气固化型硅?导热填料导热系数9/span>>2.0 W/m-K产品特点9/span>现场固化及固定;对多种基材具有粘接性能、/span>应用领域9/span>适用于需要导热和粘接的应用场景、/span>