』strong style="padding: 0px; margin: 0px; box-sizing: border-box; font-family: " ";">设备特点【/span>
■/span>整机高度防腐,可实现高精度化学机械抛光工艺;
?nbsp;选配蓝牙系统,可多机联控:/span>
?nbsp;多通道进料系统:/span>
?nbsp;在线实时磨抛盘温控及冷却功能:/span>
■span style="padding: 0px; margin: 0px; box-sizing: border-box;">磨抛盘自动冲洗功能;
』/span>设备参数【/span>
』/span>技术应?/strong>【/span>
适用材料广泛应用亍strong style="padding: 0px; margin: 0px; box-sizing: border-box; font-family: " ";">化合物半导体材料?span style="padding: 0px; margin: 0px; box-sizing: border-box; font-family: " "; color: rgb(255, 0, 0);">金属薄膜?strong style="padding: 0px; margin: 0px; box-sizing: border-box; font-family: " ";">光电材料等平面、端面及角度抛光,由于整机高度防腐,耐强酸强碱强氧化剂,除主要加工材料氮化镓、金刚石、氧化镓、多晶碳化硅外,还特别适用于CZT、MCT、GaAs、InP及类似材料的化学抛光、/span>
应用领域广泛应用亍/span>半导体材料衬底减薄抛先/span>?/span>器件制备?/span>先进封装叉/span>MEMS等相关领域,例如TC-SAW、FBAR、激光器、硅光子器件、TSV、SIP、Fan-out、MEMS高温压力传感器、MEMS陀螺仪等、/span>
』strong style="padding: 0px; margin: 0px; box-sizing: border-box; font-family: " ";">设备说明【/span>
◊span style="padding: 0px; margin: 0px; box-sizing: border-box;">整机高度防腐,可?span style="padding: 0px; margin: 0px; box-sizing: border-box; font-family: " "; color: rgb(255, 0, 0);">耐强酸强碱强氧化剁/strong>的工艺环境下实现稳定高效运行:/span>
?nbsp;研磨抛光盘转速可自主设定,转速范围为0-120rpm:/span>
?nbsp;工作时间可自主设定,连续运转时间可达10个小旵/span>:/span>
◊span style="padding: 0px; margin: 0px; box-sizing: border-box;">通过选配蓝牙系统可实现一个终端多机联控,减少人工,且工艺程序所有控制参数均可在显示屎span style="padding: 0px; margin: 0px; box-sizing: border-box; color: rgb(255, 0, 0);">独立显示:/span>
?nbsp;研磨工艺转到抛光工艺时,研磨盘与抛光盘的更换简捷方便,全系列磨头及附件均适配:/span>
?nbsp;填料系统自动控制,滴料速度可调:/span>
?nbsp;夹具摆幅及速度可精确控制,专/span>摆幅范围??00%:/span>
?nbsp;夹具压力可调,可调范围可辽strong style="padding: 0px; margin: 0px; box-sizing: border-box; font-family: " ";">7kg:/span>
?nbsp;样品去除厚度可控,去除量精度1μm:/span>
?nbsp;配有独立真空单元,样片通过真空吸附固定到夹具上面;
?nbsp;可定制固定组件,实现端面及角?/span>磨抛工艺:/span>
◊span style="padding: 0px; margin: 0px; box-sizing: border-box;">可选配盘温监控功能,监测精?span style="padding: 0px; margin: 0px; box-sizing: border-box; color: rgb(255, 0, 0);">1ℂ/strong>:/span>
?nbsp;可独立显示并指示实际工作时长,在完成既定工艺程序名strong style="padding: 0px; margin: 0px; box-sizing: border-box; font-family: " ";">自动关机、/span>
』strong style="padding: 0px; margin: 0px; box-sizing: border-box; font-family: " ";">系列型号【/span>
合美半导体(北京)有限公司为您提供合美半导体HSM-LP系列,HSM-LP系列产地为北京,属于研磨机,除了HSM-LP系列的参数、价格、型号、原理等信息外,还可为您提供CMP设备、抛光液、研磨料桶