型号:HG962CMP抛光�?蓝绿艱�
  硬�?邵A92+3;
  填充物:氧化�?氧化�?氧化铇�
  密�?0.6±2;
  适用于蓝宝石衬底片和窗口片及硬质合金和半导体材料的粗,中抛光。产品切削率高，不塌边，无划伤、�/span>

  Model:HG962CMP Polishing Pad;
  Color:Blue-Green;
  Hardness:Shore A92±3;
  Fillers:Aluminum Oxide,Zirconia,Cerium Oxide;
  Density:0.6±0.02;
  Suitable for rough and medium polishing of sapphire substrate films,window films,hard alloys,and semiconductor materials.It enables higher cutting rates,no edge collapse,and no scratches on the processed workpieces.