高级会员
已认?/p>
| 品牌９/td> | Nordson DAGE |
| 产地９/td> | 英国 |
| 关注度： | 1226 |
| 型号９/td> | DAGE4300FP |
4300FP - Semi-automatic Wafer Bump Testing
The Nordson DAGE 4300FP eliminates manual handling of expensive wafers. It improves cleanliness through isolation of bondtester and wafer handler and increases productivity through semi-automatic testing.
Shear testing using Nordson DAGE's patented air bearing frictionless intelligent load cell system
Fully automatic wafer handling via customer's third party robot handler (SMIF/FOUP) equipment
Wafer handler and bondtester can operate in isolated environment with minimum operator interaction
Joystick manipulation of 100% of wafer surface under test head without repositioning of wafer
Semi-automatic test routines using 2 reference points (no camera system required) per wafer enable bondtesting to the entire wafer surface without repositioning
460mm x 300mm XY stage with robot compatible chuck. Pneumatically operated pins allow wafer exchange using a robot handler
360 degree load tool rotation - optional
Automatic calibration and linearity checks
Integrated analysis including statistics and SPC functions
ODBC compliant
- DAGE4300FP半自动晶圆凸块测试系统的工作原理介绍＞/li>
- DAGE4300FP半自动晶圆凸块测试系统的使用方法＞/li>
- DAGE4300FP半自动晶圆凸块测试系统多少钱一台？
- DAGE4300FP半自动晶圆凸块测试系统使用的注意事项
- DAGE4300FP半自动晶圆凸块测试系统的说明书有吗？
- DAGE4300FP半自动晶圆凸块测试系统的操作规程有吗＞/li>
- DAGE4300FP半自动晶圆凸块测试系统的报价含票含运费吗＞/li>
- DAGE4300FP半自动晶圆凸块测试系统有现货吗？
- DAGE4300FP半自动晶圆凸块测试系统包安装吗？
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