OAI的面板级掩模光刻� Model 6020S�

用于FOPLP型号6020S -半自动化或自动化＋�/span>实现500mm x 500mm晶圆尺寸的FO-PLP加工.

OAI’s Panel Level Mask Aligner for FOPLP Model 6020S - Semi or Automated

Enabling FO-PLP Processing at 500mm x 500mm Wafer Sizes

OAI掩模对准器，不同的印刷方弎�/span>

距离:间隙可设置在一个非常宽的范围内＋�/span>增量精度1��M

软接�??基材被带入非常柔软的机械接触曝光时的掩模。通过接触力可谂�/span>软件设置

金属触点:?接触额外的氮气压劚�/span>

真空接触:?真空级别控制接触力。真空度丹�/span>由用户设�?/span>

OAI Mask Aligners

Various Printing Modes

PROXIMITY:

? THE GAP IS SETTABLE OVER A VERY WIDE RANGE WITH AN INCREMENTAL PRECISION OF 1��M

SOFT CONTACT:

? SUBSTRATE IS BROUGHT INTO VERY SOFT MECHANICAL CONTACT WITH THE MASK DURING EXPOSURE. THE CONTACT FORCE IS ADJUSTABLE VIA SOFTWARE SETTINGS

HARD CONTACT:

? CONTACT WITH ADDITIONAL N2 pressure VACUUM CONTACT:

? VACUUM LEVEL CONTROLS THE CONTACT FORCE. LEVEL OF VACUUM IS SET BY USER