OAI Model 800E型掩模对准系绞�/span>

。各种光谱范围选项:Hg�?G(436nm)，H(405nm)� I(365nm)�?10nm线，Hg-Xe�?260nm�?20nm

。基片尺寸范围从4�?”直徃�/span>

。灯功率范围�?00�?000W或LED

。电脑操作和配方存储

。易于使用的GUI和多功能操纵杅�/span>

。手动对齐在顶部和底部双2 mp GigE摄像机和机动的X-Y-Z-Theta舞台与操纵杆/菜谱操作

。升级到自动对齐w / Cognex软件升级

。楔自动补偿和机动z轳�/span>带有编码器和3点水准升级选项

。红外光学背面对齐选择升级

、�/span>接近(20um): 3.0um，软触点:2.0um，硬触点:1um，真空触炸��?.5um

。提供正面和背面接触和对齏�/span>0.5 - 1的准确�?/span>

。提供半自动�?研发和低容量生产模式

。适用于MEMS、半导体、Microfludic纳米印记，PSS衬底和CLiPP流程

Model 800E Mask Aligner System

� Various Spectra Range Options: Hg Lamp: G (436nm)� H (405nm)� I(365nm) and 310nm lines� Hg-Xe Lamp: 260nm and 220nm

� Substrate sizes range from 4� to 8� diameter or square

� Lamp Power range from 200 to 2�?00W or LED

� PC Operation and Recipe Storage

� Easy to use GUI and Multifunction Joystick

� Manual Alignment with Top and Bottom Dual 2MP GigE Cameras and Motorized X-Y-Z-Theta Stage with Joystick / Recipe Operation

� Upgrade to Auto Alignment w/ Cognex Software Upgrade

� Automated wedge compensation and motorized z-axis with encoder and option for 3 Point Leveling Upgrade

� IR Optics Backside Alignment Option upgrade

� Proximity (20um): <3.0um� Soft Contact: <2.0um� Hard contact: 1um and vacuum contact : � 0.5um

� Provides Front and backside exposure and alignment accuracy of 0.5-1um

� Available in semi automated / R&D and low volume production modes

� Applicable for MEMS� Semiconductor� Microfludic� NanoImprinting� PSS Substrate and CLiPP Processes