产品概述/Product Introduction９�/span>

� 籽晶的粘接工艺技术是将SiC籽晶通过有机胶粘接在石墨纸上。提高籽晶粘接质量是保证高品质SiC晶体生长的首要前提、�/p>

The bonding technology of seed crystal is to bond SiC seed crystal to graphite paper through organic adhesive. Improving the bonding quality of seed crystal is the first prerequisite to ensure the growth of high-quality SiC crystal. .

技术指�?Technical Indicators９�/span>

晶圆尺寸: 6-8英寸 Wafer size: 6-8 inches	温度350-1000°C,温度均匀性土3°C Temperature 350 1000°C, temperature uniformity 3°C
压力:**1-2万KN，力均匀�?lt;�?% Pressure: Maximum 1-20,000 KN, Force Uniformity<�?%	真空�?�?0Pa Vacuum degree:�?0Pa
压头:柔性压�?硬性压夳�/p> Indenter: Flexible indenter/rigid indenter