参考价栻/p>面议
型号
Si-on-金刚矲/span>品牌
青禾晶元产地
北京样本
暂无目数9/p>-
纯度9/p>-
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Si-on-金刚矲/p>
基于键合技术实现了金刚石基硅复合衬底,有望解决高功率密度硅器件散热能力不足的难颗/p>
Based on the bonding technology, Si-on-diamond substrate has been realized, which is expected to solve the problem of insufficient heat dissipation of Si devices with high power density.
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