功率(kw):
-重量(kg):
-规格外形(长*?高)9/p>-
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型号:HG1000CMP抛光?白色;
硬?邵D60±5;无填斘
密?0.85±5;
适用于半导体晶体和硬质合金的精密抛光。可使被加工工件的抛光平整度更加一?划伤度更低、/span>
Model:HG1000CMP Polishing Pad;
Color:White;
Hardness:Shore D60±5;No Fillers;
Density:0.85±0.05;
Suitable for precision polishing of semiconductor crystals and hard alloys.It enables a more consistent flatness and lower scratch levels on the processed workpieces.
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