**可切断的工件尺寸�?56×156×700mm
切割速度�?800m/min
机器重量�?2500kg
本机器主要用于硅片、玻璃等各种硬、脆性材料切割分解成片状，可达到提高切割精度，提高工作效率，节省原材料，减少下道工序工作量的目的、�br style="box-sizing: border-box; animation-fill-mode: both; overflow-wrap: break-word; word-break: normal; padding: 0px; margin: 0px;"/>The machine is mainly used for cutting and decomposing all kinds of hard and brittle materials such as silicon wafer and glass into sheets, which can improve cutting accuracy, improve work efficiency.