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首页 > 产品中心 > 制样/消解设备 > 法国VINCI切片与磨抛三用机SGL200
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法国VINCI切片与磨抛三用机SGL200
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产品简今/div>

切片与磨抛三用机(SGL 200)

SGL200是一台多功能一体机。可进行切片,磨片和抛光。该机器的关键部件包括:强化钢研磨盘,金刚石切割锯片,金刚石砂轮和用于多尺寸加持的真空吸盘。吸盘在切片和研磨操作过程中有效加持薄片。通过手动可将样品直接从切割刀片转移到砂轮上,从而简化了工序并节省了时间。切片的厚度可通过螺母调节,另外设备自带一个精密的千分尺精确测量薄片的磨削厚度。样品研磨为手动操作,同时碳化硅研磨液将从喷嘴周期性地滴落在磨盘上、/span>

产品规格9/span>

重量9/span>50公斤

尺寸9/span>640x340x350毫米

电源9/span>220VAC?0/60Hz

锯片直径9/span>200毫米?英寸(/span>

磨轮直径9/span>200毫米?英寸),粒径?6

试样尺寸9/span>2?045厘米??0x45厘米

研磨盘直徃/span>:200毫米

研磨盘转速:150?分钟

切片厚度9/span>100-150微米

产品优点9/span>

设计紧凑,操作简協/span>

切片磨片抛光三合一

快速和准确的制栶/span>

Slicing grinding and lapping machine (SGL 200)

The multi-purpose SGL200 can slice grind and lap specimens using only one instrument. A high grade steel lapping disc diamond-cutting blade diamond-grinding wheel and versatile vacuum chuck for various slide sizes are the key components of the machine. The latter grasps the thin section during slicing and grinding operations. The sample is directly transferred from the cutting blade to the grinding wheel by virtue of a manually rotated wheel thereby facilitating the procedure and saving time. An adjustable screw controls the slicing thickness while a precision micrometer monitors grinding thickness of thin section. Sample lapping consists of first manually holding the sample in place while a silicon carbide solution is periodically poured over the disc.

FEATURES:

Specimen size: two specimens of 30x45mm or 1”x1.5“/trans>

one specimen of 60x45 mm or 1”x 3“/trans>

( other upon request)

Slicing Blade : ?200mm

Grinding wheel : s traight cup-wheel ?200. Grit 46

Lapping disc diameter : 200 mm

Lapping disc speed : 150 rpm Lubricants : water

Motor speed: 3?00 rpm

Weight: 50 kg

Dimensions: 640x340x350 mm

Power supply: 220 VAC 50/60 Hz

BENEFITS: * Three functions in one instrument

* Compact simple and robust

* Fast and very accurate slicing grinding and lapping operations

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