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法国VINCI半自动抛光机LGP250-P
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产品简今/div>

半自动抛光机'/span>LGP 250-P(/span>

LGP 250-P是专门为小规模抛光操作设计的设备。此设备坚固,简单易用,?小的投资同样得到高质量的抛光表面。转速可调节范围10-600rpm。抛光过程需要配合抛光布或磁性抛光盘来使用。本设备提供带有支架的抛光头,同时抛?个薄片。抛光头的压力可调节,单个样?*可到施压200克。设备共有两套样品支架,适用?0x45厘米?x1.5英寸)的样品、/span>

产品规格9/span>

重量9/span>50公斤

尺寸9/span>526589380毫米

电源9/span>220VAC?0/60Hz

研磨盘直徃/span>:250毫米

研磨盘转速:10-600?分钟

产品优点9/span>

低速时也无振动

易于快速清?/span>

同时处理*多四个样?/span>

Semi automated polishing machine (LGP 250-P)

The LGP 250-P is a single purpose apparatus specifically designed for small-scale polishing operations. The robust simple to use system provides high quality polished chips and thin sections with the minimum capital investment. The disc speed can be varied from 10-600 rpm. Polishing is achieved by means of polishing cloths or magnetic polishing discs. A polishing head with four holders for the chip or thin section production is supplied. The former allows efficient simultaneous polishing of up to 4 samples. Variable up to 200 gram weights apply a force to hold the sample’s position on the disc. Two sets of four specimen holders are supplied to suit either 30x45mm or 1 x 1.5 inch samples.

FEATURES:

Variable speed: 10 to 600 RPM

Specimen size : 30x45mm or 1 x 1.5 inches

Plate diameter: 250 mm

Dimensions: 526 x 589 x 380 mm

Weight: 50 kg

Power supply: 220 VAC - 50/60 Hz

BENEFITS:

* Free vibration at low speeds

* Polishs chips or thin sections

* Easy access for rapid and effortless leaning

* Simultaneous polishing up to four samples

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