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DBT1000 |
DBT-1200 |
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Speci? cations: Die size: from 300x300m Thickness: from 3 mil and up 2 basic con? gurations: ? Modul I : XYZ and Theta for Chip handling ? Modul II : XYZ hi resolution for multi chuck Shuttle and pin Test centering Z motion with adjustable angle Pickup Tool offset to Crosshair: programmable Test Pin to crosshair: programmable Joystick: proportionnal speed Chip hold on chuck by vacuum Two LCD display used for wafer handling and for Test Monitoring. Video Target generator for alignment. Lights: Direct and pen LED lights. |
Speci?cations: Die size: from 250x250m (10mil) Thickness: from 75m (3 mil) and up 2 basic con? gurations: ? Modul I : XYZ and Theta for Chip handling ? Modul II : XYZ hi resolution for multi chuck Shuttle and pin Test centering Z motion with adjustable angle Pickup Tool offset to Crosshair: programmable Test Pin to crosshair: programmable Joystick: proportionnal speed Chip hold on chuck by vacuum Two LCD display used for wafer handling and for Test Monitoring. Video Target generator for alignment. Lights: Direct and pen LED lights. Facilities: Power: 100-240vac |
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