漆膜附着力测诔�/strong>

Film adhesion testing of thin films and stacks on substrates for material evaluation

3DIC TSV and BWS TTV硅片表面形貌测量

Film Stress薄膜应力量测�?/span>

FEOL Electrical Characterization 电学特�?/span>

Thin wafer metrology 晶圆测量�?/span>

Film Adhesion漆膜附着力测诔�/strong>

Film adhesion testing

of thin films and stacks on substrates

for material evaluation.

FSM offers two techniques suitable for low and medium adhesion strength tests.